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Topic: Design


Page 8 of 13 pages.
Samsung Electronics Selects Optomec’s Aerosol Jet for Next-Generation Electronics Production
Electronics producers are now using the aerosol jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multi-layer, miniature circuits.

NAND Flash Finds a Home in the IoT
Advances in the technology now let NAND flash memory offer faster throughput, greater flexibility and better price points per byte, opening the door for its use as primary storage.

The IoT Processor Dilemma
Proliferation of Internet of Things connected devices has led to increased complexities in product design.

3D Printing Permissions
Coming soon to an additive manufacturing shop near you: digital rights management for 3D printing.

HxGN 2019 where AR/VR meets Metrology; Epson Releases Augmented Reality Remote Assist
Hexagon's HxGN highlights intersection of AR/VR and metrology; Epson launches AR-based remote assistance app.

Siemens Adds Augmented Reality for Enhanced Visualization and Collaboration to Solid Edge 2020
New simulation validation capabilities help to improve quality and reduce costly prototypes, company says.

Researchers in Denmark Apply AI to Autonomous Drones
The AiR Lab designs and prints its own drone prototypes while developing hybrid controllers.

Rand 3D Brings Training Solutions to PTC LiveWorx 2019
Training and custom documentation solutions help maximize effectiveness of CAD and PLM software implementations.

The New Age of GPU-Driven Product Design
Software companies are finding ways to accelerate CAD with GPUs beyond graphics and rendering.

Contest Helps Spur Student Curiosity in STEM
Student Design Competition Profile: BEST Robotics

Ford Pilots 3D Printing Initiative for Tooling
The goal is to allow local plant floor workers without 3D printing experience to generate tools, jigs and fixtures using Ultimaker 3D printers.

SPEE3D Supersonic 3D Printing Design Challenge Kicks Off at RAPID + TCT 2019
Entries open at RAPID + TCT 2019 on May 20, 2019 and will be accepted until June 30, 2019.

Siemens Introduces Validation Program to Accelerate Autonomous Vehicle Development
Siemens' PAVE360 provides a comprehensive environment for multi-supplier collaboration across the automotive ecosystem for the development of next-generation automotive chips, according to the company.

5G Concerns and Opportunities at IoT World 2019
Anxieties and opportunities around 5G at IoT World 2019, One-Click VR from Luxion KeyShot, ASSESS Congress set for October

Techniplas: Combining Additive Manufacturing (AM), Generative Design, and AI to Explore Lightweighting
In partnership with generative design software maker Paramatters, Techniplas offers free browser-based manufacturing portal to attract lightweighting projects



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