Emerson announces PACSystems, a new line of industrial computing platforms

Industrial PCs provide powerful, rugged computing platform for AI-enabled automation

By Robotics 24/7 Staff    September 20, 2025         

Emerson announces PACSystems, a new line of industrial computing platforms

Emerson

New Emerson PACSystems IPCs combine the latest generation of industrial-rated processors with optimized cooling and pre-loaded software to simplify advanced computing and integration.

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Emerson announces PACSystems, a new line of industrial computing platforms

Emerson

New Emerson PACSystems IPCs combine the latest generation of industrial-rated processors with optimized cooling and pre-loaded software to simplify advanced computing and integration.

Advanced automation technology provider Emerson Automation Systems announced the PACSystems IPC 6010, IPC 7010 and IPC 8010 industrial computing platforms.

This new line expands Emerson’s family of high-performance industrial personal computer (IPC) models for demanding applications, including artificial intelligence, machine learning and advanced analytics.

Processors designed to support AI-enabled applications

Emerson said that the PACSystems IPCs feature the first CPU in the latest generation of processors designed specifically to support AI-enabled capabilities such as predictive maintenance, process optimization, quality inspection, decision support, supply chain management and more.

Critical digital transformation applications require reliable and ruggedized computing platforms, with the high level of performance needed to support data collection, protocol conversion, historization and analytics for real-time optimization and visualization capabilities.

Emerson said the new PACSystems line features significant performance updates and more options to develop processes for challenging industrial applications, with a range of functionality and price points to support scalable operations and lower cost-of-ownership.

“These innovative, next-generation IPCs are a key part of the critical hardware backbone supporting Emerson’s Boundless Automation vision,” explained Harish Shinde, vice president and general manager for controls and software in Emerson’s discrete automation business. “PACSystems IPCs are an ideal platform for developers seeking to future-proof industrial systems and achieve continuous uptime even in extreme environments as they create IoT, AI, and other advanced applications”

The new line of IPCs use the latest generation of soldered industrial-rated 13th Generation Intel Core Processors with up to 64 GB soldered ECC memory, for maximum resistance against shock and vibration. Emerson said their compact form factor employs fan-less cooling for an extended operating temperature range up to 70 degrees Celsius, with thermal monitoring and an optional fan available for high-temperature environments. PACSystems IPCs benefit from Emerson’s patented vibration and thermal technologies to boost reliability and extend deployment life.

 

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