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STMicroelectronics and Fieldscale Bring Intuitive Touch Controls to Smart Devices
January 29, 2020
Fieldscale SENSE is an end-to-end development platform for touch-sensor design and high-accuracy simulation.
Siemens Partners with Arm to Accelerate Mobility
January 10, 2020
Aim is to enhance mobility by redefining design capabilities for complex electronic systems.
Accellera Issues Standardization Initiative to Address Design Automation and Tool Interoperability for Functional Safety
November 12, 2019
Proposed working group established to determine industry interest for a standard to support a functional safety flow.
Will Robots Find a Place in the Smart Home?
November 1, 2019
For developers and engineers, emerging “social robot” applications are still a work in progress.
ExOne to Collaborate With Global Tungsten & Powders to Advance Tungsten Metal 3D Printing
October 30, 2019
Development collaboration to focus on cemented carbide, used in cutting tools and wear-resistant parts, and tungsten-copper, used in high-voltage electrical applications.
Nano Dimension Presents Production-Grade Printed Capacitors for PCBs
September 16, 2019
Capacitors 3D printed on the DragonFly system eliminate the need for assembly.
Nano Dimension Introduces DragonFly LDM for Continuous Digital Manufacturing of Electronics
July 26, 2019
HENSOLDT tests the DragonFly LDM additive manufacturing technology and discusses the results.
Nano Dimension Sells DragonFly Additive Manufacturing System to Istituto Italiano di Technologia
July 15, 2019
IIT is a research institution in Italy specializing in promoting technological development and higher education in science and technology.
Samsung Electronics Selects Optomec’s Aerosol Jet for Next-Generation Electronics Production
July 3, 2019
Electronics producers are now using the aerosol jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multi-layer, miniature circuits.
The IoT Processor Dilemma
July 1, 2019
Proliferation of Internet of Things connected devices has led to increased complexities in product design.
HP Opens New 150,000-Square-Foot 3D Printing and Digital Manufacturing Center of Excellence
June 12, 2019
The Center will be targeting R&D, engineering, co-development, and sustainable innovation for the Fourth Industrial Revolution.
ANSYS 2019 R2 Strengthens Digital Thread Between Design, Engineering and Manufacturing
June 7, 2019
Latest ANSYS release accelerates digital transformation across every industry.
Nano Dimension Collaborates with Harris Corporation for Space Project
May 31, 2019
Nano Dimension and Harris Corporation receive grant approval to create hardware to fly on the International Space Station.
5G Concerns and Opportunities at IoT World 2019
May 15, 2019
Anxieties and opportunities around 5G at IoT World 2019, One-Click VR from Luxion KeyShot, ASSESS Congress set for October
