Copley Controls releases Nano servo drives for mobile robots

Global provider of motion control components Copley Controls announced the release of its Nano High Power (Nano HP) and Nano Plus High Power (Plus-HP) digital servo drives for brush and brushless motors.

Both series expand Copley’s compact Nano family and feature redesigned power boards for higher current output. The company said the new offerings are ideal for traction motor applications in autonomous mobile robots (AMR), automated guided vehicles (AGV) and other space-limited mobile robots that require higher-power embedded modules.

Copley Controls expands Nano servo drive family

The Nano HP is based on Copley’s Nano Standard platform with ARM processor, while the Nano Plus-HP is built on the advanced Nano Plus platform with FPGA-based architecture for enhanced functionalities.

At Automatica 2025, Copley Controls demonstrated its servo drives with partners Alva Industries, Elmo Motion Control and Neugart GmbH.

Both drives operate from 9 to 90V DC input voltage and deliver up to 140A of continuous current. Copley Controls said this provides exceptional power density and efficiency. They also support EtherCAT (CoE) and CANopen communication protocols for real-time data exchange, with the Plus-HP supporting additional networking protocol options.

Additional features and specifications include:

• Safe Torque Off (STO) capability with SIL 3, Category 3, PL e conformance
• One analog input: ±10V, 12-bit (HP) / 16-bit (Plus-HP)
• 16-kHz current loop update
• 4-kHz position and velocity loop update
• Five high-speed digital inputs
• Four high-speed digital outputs, including brake
• Multiple encoder interfaces - incremental, absolute, dual feedback and digital halls
• 32-bit floating point filters and multiple advanced filters
• Frequency analysis tools

Copley Controls said Nano HP and Plus-HP drives are designed to meet the requirements of many mobile robotics applications, AGVs, AMRs and field robotics.

Standard modules can be implemented using connectors or by soldering power pins for high load current applications, while the Z-style modules’ small form factor facilitates integration with standard connectors and a frame-mounted heat plate.