Photoneo
Neousys Technology and Photoneo announced a partnership, combining rugged edge AI computing with high-resolution 3D imaging to unlock unprecedented automation capabilities.
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Photoneo
Neousys Technology and Photoneo announced a partnership, combining rugged edge AI computing with high-resolution 3D imaging to unlock unprecedented automation capabilities.
Photoneo, a Slovakia-based developer of advanced 3D cameras and imaging technology, and Neousys Technology, a Taiwan-based provider of edge AI computing platforms and rugged embedded computers, have announced a strategic partnership.
Neousys will deliver robust, high-performance computing platforms merged with Photoneo’s advanced 3D imaging technology - from Photoneo’s 3D scanners to 3D robotic intelligence software.
The integration of Neousys’ rugged, wide-temperature GPU computing systems and Photoneo’s high-resolution 3D cameras introduces a platform that can meet the demands of complex industrial environments.
“Photoneo’s world-leading high-resolution and high-accuracy 3D cameras unlock the full potential of fast machine learning by reducing training and deployment times,” said Robert Chang, sales manager at Neousys. “We are delighted that Neousys industrial GPU computers support Photoneo to lead the way for advanced 3D vision-guided robotics.”
Neousys’ industrial-grade platforms, featuring shock- and vibration-resistant GPU brackets, deliver stable and reliable edge AI processing under extreme conditions, ensuring continuous operation and minimal downtime.
“As more companies integrate 3D vision-guided robotics into their advanced automation processes, identifying innovative solutions that push boundaries and bridge gaps is essential for scaling the adoption of this technology across industries,” said Marcel Svec, VP of strategy & product at Photoneo. “Cooperation with Neousys’ range of industrial GPU computers we can provide a great performance-to-value ratio to our customers”.
The companies also highlighted the following potential benefits for efficiency and deployment versatility:
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